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Garcia, p.; Wang, S.
Localized dielectric cure monitoring through the panel thickness during oriented strandboard hot-pressing
Source: Wood and fiber science
Year published: 2005 y.
Volume: 4
Pages: pg. 691-698
Libraries: LTU
UDK:
674.7/.8
Keywords:
OSB
dielectric
heat transfer
hot-pressing
moisture
oriented strandboard
resin cure
temperature
плочи от ориентирани частици
влажност
топлинна обработка
топлопренос
плътност
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